Efeito da adição de nanopartículas de Cobre (NPCu) na microestrutura, propriedades mecânicas, elétricas e molhabilidade de nanocompósitos Sn/Bi/NPCu aplicados em ligas de soldas eletrônicas.

Abstract

This dissertation investigates the effects of copper nanoparticles (Cu) on the mechanical, electrical, and thermal properties of the eutectic Sn-58Bi alloy, a promising alternative to traditional lead-containing solder alloys. The increasing demand for high-performance, environmentally friendly soldering materials, particularly in sensitive electronic applications, motivated the analysis of how Cu nanoparticles improve solder joint performance. Thermal characterization (DSC/TGA), mechanical tests (hardness, shear strength), electrical measurements (conductivity and resistivity), and microstructural analyses were conducted. Results indicated that specific Cu nanoparticle concentrations (notably 0.8% and 1.6%) significantly enhanced electrical conductivity and microhardness of the alloy. Thermal analysis showed slight shifts in melting points, and wettability tests confirmed the alloy's suitability for industrial applications. It is concluded that Cu nanoparticle additions can optimize Sn-58Bi as a lead-free solder, reinforcing its application in modern electronic components.